Klingelnberg P26 Precision Measuring Center

     As ODTÜ DİMER, we serve the industry and academia with the Klingelnberg P26 Precision Measuring Center, which offers the latest innovations in gear measuring technology. This system is designed to measure dimensional, form, and position deviations of a wide range of workpieces, from gears to rotor shafts, with micron-level precision. Capable of measuring workpieces up to 260 mm in diameter and 80 kg in weight with a resolution of ±0.01 µm, the P26 minimizes the margin of error by offering fully automatic measurement processes with its CNC-controlled system.

Measurement Capacity:

• Workpieces up to 260 mm in diameter and 80 kg in weight
• Vertical measuring range: 400 mm (Optionally 550 mm)
• Horizontal measuring range: ±75 mm

High Precision:

• Measurements can be performed with ±0.01 µm resolution.
• Digital deviation measurement is performed in three axes thanks to 3D NANOSCAN technology.

Automation and Software:

• Fully automatic measurement process with CNC-controlled system
• Measurement data can be instantly transferred and analyzed via LAN connection.

Durable and Stable Structure:

• Its cast iron body ensures long-term mechanical stability.
• Measurement errors caused by temperature are minimized thanks to integrated temperature sensors.

Application Areas:

• Gear measurement and quality control processes
• Part verification for automotive and aerospace industries
• Micron-level measurement needs in R&D projects

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At our center, the following measurements and analyses can be performed by expert academicians and researchers in the field:

• Gear measurements: Tooth profile, curvature, helix angle, and flank roughness measurements

• Crankshaft and camshaft measurements: Axis deviations and rotational precision checks

• Rotor measurements: Rotor imbalances and geometric accuracy analyses

• Axial symmetry analyses: Detection of dimensional, form, and position deviations

Figure 1. Klingelnberg Measuring Device

Figure 2.  Klingelnberg while measuring

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DSX 2000 Digital Microscope

The DSX2000 is an advanced digital microscope designed for universal application within Materials Science. It constitutes an integral component of the laboratory infrastructure at DİMER.

I. Fundamental and Technical Hardware Specifications

With its fully motorized architecture and advanced technical hardware, the DSX2000 offers comprehensive analytical capabilities:

• All-in-One Integration: The consolidation of imaging, measurement, analysis, and reporting functions facilitates rapid acquisition of reliable results.
• Optical System: The device employs a telecentric optical system to ensure high-precision measurements with minimal distortion across the entire magnification range.
• Objectives: A selection of 17 to 20 wide-range objectives is available, featuring high resolution and long working distances.

II. Imaging and Analytical Capabilities

• Magnification Range: Utilizing optical zoom capabilities, the system achieves up to 20X optical magnification, enabling imaging across a spectrum ranging from macro- to micro-levels.
• Resolution Modes: Exceeding 4K standards, the high-resolution capacity permits the observation of minute details. The system supports Full High Definition (HD), 4K, and 8K (Ultra Mode) resolution configurations.
• Camera/Sensor: The system is equipped with a 1.1-inch, 12.37-megapixel color CMOS image sensor featuring a global shutter. It utilizes Peltier cooling to ensure imaging stability.
• Adjustable Observation Angle: The tilting frame (±90°) and rotating stage facilitate sample inspection from omnidirectional perspectives.
• Multiple Imaging Techniques: Users can access seven distinct observation methods with a single click: Brightfield (BF), Darkfield (DF), MIX, Polarization (PO), Oblique (OBQ), Differential Interference Contrast (DIC), and Shadow Relief (SR).
• Artificial Intelligence (AI) Support: The PRECIV™ image analysis software provides unique Live AI capabilities, offering customizable workflows and AI-assisted analysis to expedite inspection processes.

III. Applications at DİMER

The following analyses are conducted at DİMER utilizing the DSX2000:

• Fracture Surface Analysis (Fractography):

1. Fatigue Initiation Point Detection: Precise identification of crack initiation sites under high magnification.
2. Crack Propagation Mechanism: Analysis of microscopic fatigue striations on the fracture surface.

• Surface Wear and Damage Analysis:

1. Pitting and Spalling Analysis: Three-dimensional topographic mapping of damage resulting from fatigue.
2. Wear Profile Measurement: Precise profiling of material loss caused by sliding or rolling wear.

• Surface Treatment and Coating Quality Control:

1. Surface Hardened Layer Inspection: Examination of microstructures and potential fissures following thermal treatments such as carburizing or nitriding.

• Advanced Measurement and Automation:

1. 3D Measurement: High-precision Z-axis (depth/height) measurements of gear indentations or damage loci.
2. Automatic Image Enhancement: Automated delineation of grain boundaries and microstructures in metallurgical samples via live contrast enhancement.